Product Information
BRAND NEW THERMAL PASTE PRODUCT
We offer great quality products in the following categories
| [+] Computers & Accessories [+] Desktop & Laptop Components |
PRODUCT NAME: Cooler Master Heatsink Compunds Thermal Paste Packing Unit
Cooler Master Heatsink Compunds Thermal Paste Packing Unit
Thermal Colour :
Gray
Thermal Conductivity :
>5.15
Thermal Impedance :
3.25
Viscosity :
12500
Thixotropic Index :
280 10
Moment Beared Temperature :
- C
Operation Temperture :
-30280 C
Silicone Compounds :
10%
Carbon Compounds :
45%
Metal Oxide Compounds :
45%
Application:
High Thermal Demand Moudle
Cooling device to the end plate or between the frame
High speed and large storage Drive
Automotive Engine control
Hard disk drive and DVD drive
Power conversion apparatus
High Power LED
Notebook and desktop computers
Network Communicaion Equipment
Household appliances, electronic components, electrical
Shipping Information
| Zone | Order Total (RM) | Delivery Fee (RM) |
|---|---|---|
| West Malaysia | Flat Rate | 8.00 |
| East Malaysia | Flat Rate | 10.00 |